Ads
related to: semiconductor manufacturing flow- Refrigerated Display Case
We've got it down cold.
See Selected Applications.
- Data Centers
We Support Large Tech Companies.
Learn Why We Are Trusted.
- Ground Support
Commercial and Military Support.
See Selected Applications.
- Semiconductor Products
Semiconductor Support Equipment.
See Selected Applications.
- Refrigerated Display Case
Search results
Results From The WOW.Com Content Network
Semiconductor device fabrication. Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM ). It is a multiple-step photolithographic and physico-chemical process (with steps such as ...
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency ( RF) amplifiers, LEDs, optical computer components, and microprocessors for computers.
Back end of the line or back end of line (BEOL) is a process in semiconductor device fabrication that consists of depositing metal interconnect layers onto a wafer already patterned with devices. It is the second part of IC fabrication, after front end of line (FEOL). In BEOL, the individual devices (transistors, capacitors, resistors, etc ...
Illustration of FEOL (device generation in the silicon, bottom) and BEOL (depositing metalization layers, middle part) to connect the devices. CMOS fabrication process. The front end of line (FEOL) is the first portion of IC fabrication where the individual components (transistors, capacitors, resistors, etc.) are patterned in a semiconductor substrate. [1]
Microfabrication is the process of fabricating miniature structures of micrometre scales and smaller. Historically, the earliest microfabrication processes were used for integrated circuit fabrication, also known as "semiconductor manufacturing" or "semiconductor device fabrication". In the last two decades, microelectromechanical systems (MEMS ...
Shallow trench isolation ( STI ), also known as box isolation technique, is an integrated circuit feature which prevents electric current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology nodes of 250 nanometers and smaller. Older CMOS technologies and non-MOS technologies commonly use ...
A wafer-level package attached to a printed-circuit board. Wafer-level packaging ( WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps ...
Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which ...
Ads
related to: semiconductor manufacturing flow